منابع مشابه
Study of Traverse Grinding Process (1st Report) Accumulation Phenomenon and Size Generation Mechanism in Traverse Grinding
plicated processes on the wheel surf ace along the wheel width. In order to make these processes clear, the experimental analysis of traverse grinding was conducted by widely changing the speed ratio, Kv, the setting depth of wheel, ‡TMT, and the number of total steps, m, (the ratio of the wheel width over the traverse feed per one revolution of the workpiece). The following results were obtain...
متن کاملDesign of Robust Grinding Wheel Reciprocating Arrangement for Precision Point-grinding Machining
This research is to investigate the dynamic characteristics of the grinding process. A kind of robust grinding wheel reciprocating arrangement is schemed out, which realizes the precise point-grinding machining. The grinding wheel reciprocating movement is driven by a linear motor to replace the traditional crank or hydraulic pressure drive device. Based on the time series method, the modal exp...
متن کاملMonitoring of wheel dressing operations for precision grinding
In grinding operation, on-line process monitoring of dressing will ensure the quality of the grinding wheel and will achieve reproducible surface finish. The results of a study conducted to evaluate the feasibility and effectiveness of Acoustic Emission (AE) sensors in online monitoring of dressing is reported. Two aspects of the process are addressed. The first is the detection of undesired wh...
متن کاملPrecision Grinding of Titanium (Ti-6Al-4V) Alloy Using Nanolubrication
In this current era of competitive machinery productions, the industries are designed to place more emphasis on the product quality and reduction of cost whilst abiding by the pollution-preventing policy. In attempting to delve into the concerns, the industries are aware that the effectiveness of existing lubrication systems must be improved to achieve power-efficient and pollutionpreventing ma...
متن کاملIn-process force monitoring for precision grinding semiconductor silicon wafers
Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of gr...
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ژورنال
عنوان ژورنال: Journal of the Japan Society of Precision Engineering
سال: 1977
ISSN: 0374-3543
DOI: 10.2493/jjspe1933.43.1415